BGA reballing stencils and stencil holders for chip reballing on phone motherboards.
BGA reballing stencils are used to put new solder balls on chips after removal, which is essential for replacing or reusing ICs during board-level repair. Each stencil matches the ball pattern of specific chips, so match the stencil to the IC and phone model. Stencil holders keep the chip and stencil aligned during reballing. Use solder paste or solder balls of the correct size, and heat evenly with hot air. These tools are essential for professional repair shops that offer board-level and chip-level repair services.
Chips: IC Chipset.
Stencils help reball chips during board repairs.
Related categories: Repair Tools (Mobile Parts), Screwdriver, Screwdriver Set