Mijing 10 in 1 Motherboard IC Chip Cleaning Alpha Tin-Absorbing Wire
AR-2015
£7.00
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1. High-purity copper wire braiding can quickly absorb molten solder and improve maintenance efficiency
2. Oxidation-resistant coating, no residue design, up 80% adsorbing power
3. Strong flexibility, can fit narrow spaces and avoids damage to the chip or PCB board and other electronic components
4. Made with precision-woven copper wire, offering exceptional tin absorption performance. Rapid wicking of solder ensures faster and more efficient repairs—ideal for BGA and IC chip pin cleaning.
5. Perfect for use in smartphone/laptop/motherboard/GPU, communication device, and home appliance repair. Optimized for BGA and fine-pitch IC desoldering tasks.
New
Mijing 10 in 1 Motherboard IC Chip Cleaning Alpha Tin-Absorbing Wire AR-2015
Brand
MIJING
SKU
EDA008296801
£7.00
1. High-purity copper wire braiding can quickly absorb molten solder and improve maintenance efficiency
2. Oxidation-resistant coating, no residue design, up 80% adsorbing power
3. Strong flexibility, can fit narrow spaces and avoids damage to the chip or PCB board and other electronic components
4. Made with precision-woven copper wire, offering exceptional tin absorption performance. Rapid wicking of solder ensures faster and more efficient repairs—ideal for BGA and IC chip pin cleaning.
5. Perfect for use in smartphone/laptop/motherboard/GPU, communication device, and home appliance repair. Optimized for BGA and fine-pitch IC desoldering tasks.
2. Oxidation-resistant coating, no residue design, up 80% adsorbing power
3. Strong flexibility, can fit narrow spaces and avoids damage to the chip or PCB board and other electronic components
4. Made with precision-woven copper wire, offering exceptional tin absorption performance. Rapid wicking of solder ensures faster and more efficient repairs—ideal for BGA and IC chip pin cleaning.
5. Perfect for use in smartphone/laptop/motherboard/GPU, communication device, and home appliance repair. Optimized for BGA and fine-pitch IC desoldering tasks.
Specification:
| Package Weight |
|
2. Oxidation-resistant coating, no residue design, up 80% adsorbing power
3. Strong flexibility, can fit narrow spaces and avoids damage to the chip or PCB board and other electronic components
4. Made with precision-woven copper wire, offering exceptional tin absorption performance. Rapid wicking of solder ensures faster and more efficient repairs—ideal for BGA and IC chip pin cleaning.
5. Perfect for use in smartphone/laptop/motherboard/GPU, communication device, and home appliance repair. Optimized for BGA and fine-pitch IC desoldering tasks.
Specification:
| Package Weight |
|